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Villeneuve-Faure, C., Mitronika, M., Dan, A. P., Boudou, L., Ravisy, W., Besland, M. P., Richard-Plouet, M. & Goullet, A. (2024) Nanoscale dielectric properties of TiO2 in SiO2 nanocomposite deposited by hybrid PECVD method. Nano Ex. 5 015010.
Added by: Richard Baschera (2024-04-16 07:24:22) Last edited by: Richard Baschera (2024-04-16 07:40:29) |
| Type de référence: Article DOI: 10.1088/2632-959X/ad220d Numéro d'identification (ISBN etc.): 2632-959X Clé BibTeX: VilleneuveFaure2024 Voir tous les détails bibliographiques  |
Catégories: PCM Créateurs: Besland, Boudou, Dan, Goullet, Mitronika, Ravisy, Richard-Plouet, Villeneuve-Faure Collection: Nano Ex. |
Consultations : 1/3
Indice de consultation : 4% Indice de popularité : 1% |
| Liens URLs https://dx.doi.org ... 8/2632-959X/ad220d |
| Résumé |
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In this paper, nanocomposites (TiO2 in SiO2) are produced by an advanced hybrid aerosol-PECVD method based on direct liquid injection of a non-commercial colloidal solution in an O2 / hexamethyldisiloxane (HMDSO) low-pressure plasma. Dielectric properties are investigated at nanoscale using techniques derived from Atomic Force Microcopy in terms of relative dielectric permittivity, charge injection and transport. Results show that a concentration in TiO2 up to 14% by volume makes it possible to increase the relative dielectric permittivity up to 4.8 while maintaining the insulating properties of the silica matrix. For a TiO2 concentration in the range 15%–37% by volume, the relative dielectric permittivity increases (up to 11 for 37% TiO2 by volume) and only few agglomerated nanoparticles lowering the insulating properties are observed. For TiO2 concentration above 40% by volume, the relative dielectric permittivity still increases but the quantity of agglomerated nanoparticles is very high, which greatly increases the charge transport dynamic and degrades the insulating properties. Finally, 37% of TiO2 by volume in the SiO2 matrix appears to be the best compromise, between high dielectric permittivity and low leakage current for the MIM applications aimed.
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Publisher: IOP Publishing
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