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Lambare, C., Tessier, P. .-Y., Poncin-Epaillard, F. & Debarnot, D. (2015) Plasma functionalization and etching for enhancing metal adhesion onto polymeric substrates. RSC Adv. 5 62348–62357.
Added by: Laurent Cournède (2016-03-10 18:36:42) |
| Type de référence: Article DOI: 10.1039/c5ra08844e Numéro d'identification (ISBN etc.): 2046-2069 Clé BibTeX: Lambare2015 Voir tous les détails bibliographiques  |
Catégories: PCM Mots-clés: argon plasma, assisted metallization, Atmospheric plasma, Copper, deposition, mechanical-properties, morphology, process variables, Surface modification, thin-films Créateurs: Debarnot, Lambare, Poncin-Epaillard, Tessier Collection: RSC Adv. |
Consultations : 1/627
Indice de consultation : 4% Indice de popularité : 1% |
| Résumé |
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The metallization of plastics materials, dealing with a lot of industrial applications in the field of automotive, electronic, etc.., is generally performed by a chemical and/or electrochemical process not so ecofriendly. Therefore, this paper aims at studying an innovative two-step process for such metal coating onto ABS, ABS/PC and PEEK polymers. The first step corresponds to the plasma treatment improving the surface wettability and surface roughness. The second step is associated with the deposition of the copper metallic film by cathodic magnetron sputtering. Metallic adhesion is discussed in function of these two plasma-effects but also in function of the bias voltage or temperature substrate-holder during the film deposition. Moreover, the use of a titanium thin film as a primary layer, before copper deposition, has led to an increase of the metal/polymer adhesion.
Added by: Laurent Cournède |