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Asbani, B., Bounor, B., Robert, K., Douard, C., Athouel, L., Lethien, C., Le Bideau, J. & Brousse, T. (2020) Reflow Soldering-Resistant Solid-State 3D Micro-Supercapacitors Based on Ionogel Electrolyte for Powering the Internet of Things. J. Electrochem. Soc. 167 100551. 
Added by: Richard Baschera (2021-01-19 15:13:22)   Last edited by: Richard Baschera (2021-02-18 08:25:05)
Type de référence: Article
DOI: 10.1149/1945-7111/ab9ccc
Numéro d'identification (ISBN etc.): 1945-7111
Clé BibTeX: Asbani2020
Voir tous les détails bibliographiques
Catégories: IMN, PMN, ST2E
Créateurs: Asbani, Athouel, Bounor, Brousse, Douard, Le Bideau, Lethien, Robert
Collection: J. Electrochem. Soc.
Consultations : 6/193
Indice de consultation : 3%
Indice de popularité : 0.75%
Liens URLs     https://iopscience ... 5-7111/ab9ccc/meta
Résumé     
The fabrication of all solid-state 3D micro-supercapacitor is challenging for powering connected and miniaturized emerging electronics devices in the frame of the future Internet of Things paradigm. Here we highlight the design of a specific solid electrolyte based on ethylmethylimidazolium bis(trifluoromethanesulfonate)imide confined within polyvinylidenefluoride which enables to meet the requirements of safety, easy packaging, and leakage free 3D micro-supercapacitors. This ionogel-based microdevice (2 mm × 2 mm footprint area) exhibits good cycling stability over 30 000 cycles with an areal energy density of 4.4 μWh.cm−2 and a power density of 3.8 mW.cm−2. It can also sustain the high temperature reflow soldering process ({textasciitilde}250 °C–5 min) without damage, which is performed to directly bond surface mounted miniaturized devices onto printed circuit boards. This strategy not only provides a reference for the design of high-performance 3D interdigitated micro-supercapacitors, but also paves the way to their further implementation in miniaturized electronic chips for Internet of Things applications.
  
Notes     
Publisher: IOP Publishing
  
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