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Cardinaud, C. (2018) Fluorine-based plasmas: Main features and application in micro-and nanotechnology and in surface treatment. Comptes Rendus Chimie, 21 723–739. 
Added by: Richard Baschera (2019-01-04 11:08:44)   Last edited by: Richard Baschera (2019-01-04 11:16:35)
Type de référence: Article
DOI: 10.1016/j.crci.2018.01.009
Clé BibTeX: Cardinaud2018
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Catégories: PCM
Créateurs: Cardinaud
Collection: Comptes Rendus Chimie
Consultations : 2/846
Indice de consultation : 8%
Indice de popularité : 2%
Résumé     
Fluorine cold plasmas produced by an electrical discharge in SF6, CF4, CHF3 or C(4)Fg gases, principally, have two main fields of application. The first and historical application is etching of materials for microelectronics and later for micro- and nanotechnology. The second concerns the modification of surface properties, mostly in terms of reflectance and wettability. After an introduction to cold plasmas and plasma-surface interaction principles, the article aims at presenting successively the evolution of fluorine plasma etching processes since the origin with respect to other halogen-based routes in microelectronics, the important and raising application in deep etching and microtechnology, and finally some examples in surface treatment. (C) 2018 Academie des sciences. Published by Elsevier Masson SAS.
  
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