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Bahi, M. A., Lecuyer, P., Fremont, H. & Landesman, J. .-P. (2007) Sequential environmental stresses tests qualification for automotive components. Microelectron. Reliab. 47 1680–1684.
Added by: Laurent Cournède (2016-03-10 22:02:29) |
| Type de référence: Article DOI: 10.1016/j.microrel.2007.07.004 Numéro d'identification (ISBN etc.): 0026-2714 Clé BibTeX: Bahi2007 Voir tous les détails bibliographiques  |
Catégories: PCM Mots-clés: gold-aluminum bonds, reliability, temperature Créateurs: Bahi, Fremont, Landesman, Lecuyer Collection: Microelectron. Reliab. |
Consultations : 1/514
Indice de consultation : 3% Indice de popularité : 0.75% |
| Résumé |
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The purpose is to create a new qualification methodology for plastic encapsulated electronic components used in an automotive environment at high temperature. It is based on the acceleration of failure mechanisms like ball bond lift (due to intermetallic Au-Al thickness growth), by combination of environmental stresses. The delamination measurement was used as an indicator of potential assembly weaknesses. An optimized package sequential qualification test flow is proposed. (C) 2007 Elsevier Ltd. All rights reserved.
Added by: Laurent Cournède |