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Bahi, M. A., Lecuyer, P., Fremont, H. & Landesman, J. .-P. (2007) Sequential environmental stresses tests qualification for automotive components. Microelectron. Reliab. 47 1680–1684. 
Added by: Laurent Cournède (2016-03-10 22:02:29)
Type de référence: Article
DOI: 10.1016/j.microrel.2007.07.004
Numéro d'identification (ISBN etc.): 0026-2714
Clé BibTeX: Bahi2007
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Catégories: PCM
Mots-clés: gold-aluminum bonds, reliability, temperature
Créateurs: Bahi, Fremont, Landesman, Lecuyer
Collection: Microelectron. Reliab.
Consultations : 7/308
Indice de consultation : 1%
Indice de popularité : 0.25%
Résumé     
The purpose is to create a new qualification methodology for plastic encapsulated electronic components used in an automotive environment at high temperature. It is based on the acceleration of failure mechanisms like ball bond lift (due to intermetallic Au-Al thickness growth), by combination of environmental stresses. The delamination measurement was used as an indicator of potential assembly weaknesses. An optimized package sequential qualification test flow is proposed. (C) 2007 Elsevier Ltd. All rights reserved.
Added by: Laurent Cournède  
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