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Bahi, M. A., Lecuyer, P., Gentil, A., Fremont, H., Landesman, J.-P., Christien, F. & Le Gall, R. (2008) Degradation Mechanisms of Au-Al Wire Bonds During Qualification Tests at High Temperature for Automotive Applications: Quality Improvement by Process Modification. IEEE Trans. Device Mater. Reliab. 8 484–489. 
Added by: Laurent Cournède (2016-03-10 21:58:41)
Type de référence: Article
DOI: 10.1109/TDMR.2008.2001703
Numéro d'identification (ISBN etc.): 1530-4388
Clé BibTeX: Bahi2008
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Catégories: PCM
Mots-clés: Au-Al wire bond, automotive application, High temperature, interfacial reactions, pd addition, reliability
Créateurs: Bahi, Christien, Fremont, Gentil, Landesman, Le Gall, Lecuyer
Collection: IEEE Trans. Device Mater. Reliab.
Consultations : 3/482
Indice de consultation : 2%
Indice de popularité : 0.5%
Résumé     
Several package families used in automotive environment were aged at different high temperatures. The purpose was to better characterize the predominant failure mechanism of ball bonds and to identify the most influential technological parameters on it. The mechanism is related to the Kirkendall effect, which is a consequence of the Au-Al intermetallic phase growth. For identical materials, the package geometry plays a crucial role: experimental results are confirmed by both analytical model and finite-element simulations. To extend the qualification domain to the biggest package size, the wire bonding process must be improved. In particular, the use of Au-1 wt.\% Pd instead of pure Au is investigated, showing that this alloy permits to decrease the Au-Al intermetallic growth and, hence, to increase the lifetime.
Added by: Laurent Cournède  
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