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| Adda, C., Corraze, B., Stoliar, P., Diener, P., Tranchant, J., Filatre-Furcate, A., Fourmigue, M., Lorcy, D., Besland, M.-P., Janod, E. & Cario, L. (2018) Mott insulators: A large class of materials for Leaky Integrate and Fire (LIF) artificial neuron. J. Appl. Phys. 124 152124. |
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| Bouchoule, S., Vallier, L., Patriarche, G., Chevolleau, T. & Cardinaud, C. (2012) Effect of Cl-2- and HBr-based inductively coupled plasma etching on InP surface composition analyzed using in situ x-ray photoelectron spectroscopy. J. Vac. Sci. Technol. A, 30 031301. |
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| Added by: Laurent Cournède 2016-03-10 21:28:39 |
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| Chanson, R., Rhallabi, A., Fernandez, M. C., Cardinaud, C., Bouchoule, S., Gatilova, L. & Talneau, A. (2012) Global Model of Cl-2/Ar High-Density Plasma Discharge and 2-D Monte-Carlo Etching Model of InP. IEEE Trans. Plasma Sci. 40 959–971. |
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| Added by: Laurent Cournède 2016-03-10 21:28:39 |
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| Ghenzi, N., Rubi, D., Mangano, E., Gimenez, G., Lell, J., Zelcer, A., Stoliar, P. & Levy, P. (2014) Building memristive and radiation hardness TiO2-based junctions. Thin Solid Films, 550 683–688. |
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| Added by: Florent Boucher 2016-04-29 09:26:46 |
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| Lallement, L., Gosse, C., Cardinaud, C., Peignon-Fernandez, M. .-C. & Rhallabi, A. (2010) Etching studies of silica glasses in SF6/Ar inductively coupled plasmas: Implications for microfluidic devices fabrication. J. Vac. Sci. Technol. A, 28 277–286. |
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| Added by: Laurent Cournède 2016-03-10 21:37:33 |
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| Lallement, L., Rhallabi, A., Cardinaud, C. & Fernandez, M. C. P. (2011) Modelling of fluorine based high density plasma for the etching of silica glasses. J. Vac. Sci. Technol. A, 29 051304. |
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| Added by: Laurent Cournède 2016-03-10 21:32:20 |
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| Lecadre, F., Damian, A., Braems, I., Maroun, F. & Allongue, P. (2015) Ni electrochemical epitaxy on unreconstructed Au(111): An in-situ STM study. Surf. Sci. 631 135–140. |
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| Li, D., Carette, M., Granier, A., Landesman, J. P. & Goullet, A. (2012) Spectroscopic ellipsometry analysis of TiO2 films deposited by plasma enhanced chemical vapor deposition in oxygen/titanium tetraisopropoxide plasma. Thin Solid Films, 522 366–371. |
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| Added by: Laurent Cournède 2016-03-10 21:28:38 |
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| Nguyen, T.-P. (2011) Polymer-based nanocomposites for organic optoelectronic devices. A review. Surf. Coat. Technol. 206 742–752. |
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| Added by: Laurent Cournède 2016-03-10 21:32:19 |
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| Pereira, J., Pichon, L. E., Dussart, R., Cardinaud, C., Duluard, C. Y., Oubensaid, E. H., Lefaucheux, P., Boufnichel, M. & Ranson, P. (2009) In situ x-ray photoelectron spectroscopy analysis of SiOxFy passivation layer obtained in a SF6/O-2 cryoetching process. Appl. Phys. Lett. 94 071501. |
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| Added by: Laurent Cournède 2016-03-10 21:41:24 |
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| Quinteros, C., Zazpe, R., Marlasca, F. G., Golmar, F., Casanova, F., Stoliar, P., Hueso, L. & Levy, P. (2014) HfO2 based memory devices with rectifying capabilities. J. Appl. Phys. 115 024501. |
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| Added by: Florent Boucher 2016-04-29 09:26:45 |
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| Raballand, V., Cartry, G. & Cardinaud, C. (2007) A model for Si, SiCH, SiO2, SiOCH, and porous SiOCH etch rate calculation in inductively coupled fluorocarbon plasma with a pulsed bias: Importance of the fluorocarbon layer. J. Appl. Phys. 102 063306. |
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| Added by: Laurent Cournède 2016-03-10 22:02:29 |
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| Raballand, V., Cartry, G. & Cardinaud, C. (2007) Porous SiOCH, SiCH and SiO2 etching in high density fluorocarbon plasma with a pulsed bias. Plasma Process. Polym. 4 563–573. |
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| Added by: Laurent Cournède 2016-03-10 22:02:29 |
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| Scalabrini, M., Hamon, J., Linossier, I., Ferrieres, V. & Rehel, K. (2019) Pseudomonas aeruginosa resistance of monosaccharide-functionalized glass surfaces. Colloid Surf. B-Biointerfaces, 183 UNSP 110383. |
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| Last edited by: Richard Baschera 2019-12-20 09:46:48 |
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| Supiot, P., Vivien, C., Granier, A., Bousquet, A., Mackova, A., Escaich, D., Clergereaux, R., Raynaud, P., Stryhal, Z. & Pavlik, J. (2006) Growth and modification of organosilicon films in PECVD and remote afterglow reactors. Plasma Process. Polym. 3 100–109. |
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| Added by: Florent Boucher 2016-05-12 13:21:37 |
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