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Bargiela, P., Fernandez, V., Cardinaud, C., Walton, J., Greiner, M., Morgan, D., Fairley, N. & Baltrusaitis, J. (2021) Towards a reliable assessment of charging effects during surface analysis: Accurate spectral shapes of ZrO2 and Pd/ZrO2 via X-ray Photoelectron Spectroscopy. Applied Surface Science, 566 150728.   
Last edited by: Richard Baschera 2021-09-27 09:03:37 Pop. 1%
Baudet, E., Cardinaud, C., Boidin, R., Girard, A., Gutwirth, J., Nemec, P. & Nazabal, V. (2018) X-ray photoelectron spectroscopy analysis of Ge-Sb-Se pulsed laser deposited thin films. Journal of the American Ceramic Society, 101 3347–3356.   
Last edited by: Richard Baschera 2018-07-24 13:54:54 Pop. 1%
Bouchoule, S., Chanson, R., Pageau, A., Cambril, E., Guilet, S., Rhallabi, A. & Cardinaud, C. (2015) Surface chemistry of InP ridge structures etched in Cl-2-based plasma analyzed with angular XPS. J. Vac. Sci. Technol. A, 33 05E124.   
Added by: Laurent Cournède 2016-03-10 18:36:41 Pop. 0.75%
Cardinaud, C. (2018) Fluorine-based plasmas: Main features and application in micro-and nanotechnology and in surface treatment. Comptes Rendus Chimie, 21 723–739.   
Last edited by: Richard Baschera 2019-01-04 11:16:35 Pop. 1.75%
Chanson, R., Rhallabi, A., Fernandez, M. C., Cardinaud, C. & Landesman, J. P. (2013) Modeling of inductively coupled plasma Ar/Cl-2/N-2 plasma discharge: Effect of N-2 on the plasma properties. J. Vac. Sci. Technol. A, 31 011301.   
Added by: Laurent Cournède 2016-03-10 21:23:32 Pop. 0.5%
Chanson, R., Rhallabi, A., Fernandez, M. C. & Cardinaud, C. (2013) Modeling of InP Etching Under ICP Cl2/Ar/N2 Plasma Mixture: Effect of N2 on the Etch Anisotropy Evolution. Plasma Process. Polym. 10 213–224.   
Added by: Laurent Cournède 2016-03-10 21:23:31 Pop. 0.5%
Chanson, R., Bouchoule, S., Cardinaud, C., Petit-Etienne, C., Cambril, E., Rhallabi, A., Guilet, S. & Blanquet, E. (2014) X-ray photoelectron spectroscopy analysis of the effect of temperature upon surface composition of InP etched in Cl-2-based inductively coupled plasma. J. Vac. Sci. Technol. B, 32 011219.   
Added by: Florent Boucher 2016-04-29 09:26:45 Pop. 0.5%
Dain, G. L., Laourine, F., Guilet, S., Czerwiec, T., Marcos, G., Noel, C., Henrion, G., Cardinaud, C., Girard, A. & Rhallabi, A. (2021) Etching of iron and iron-chromium alloys using ICP-RIE chlorine plasma. Plasma Sources Science and Technology, 30 095022.   
Last edited by: Richard Baschera 2021-10-25 15:13:56 Pop. 1.75%
Ettouri, R., Tillocher, T., Lefaucheux, P., Boutaud, B., Fernandez, V., Fairley, N., Cardinaud, C., Girard, A. & Dussart, R. (2021) Combined analysis methods for investigating titanium and nickel surface contamination after plasma deep etching. Surface and Interface Analysis, n/a 110508.   
Last edited by: Richard Baschera 2021-11-18 10:01:45 Pop. 2.5%
Godet, L., Radovanov, S., Sheuer, J., Cardinaud, C., Fernandez, N., Ferro, Y. & Cartry, G. (2012) Ion energy distributions measured inside a high-voltage cathode in a BF3 pulsed dc plasma used for plasma doping: experiments and ab initio calculations. Plasma Sources Sci. Technol. 21 065006.   
Added by: Laurent Cournède 2016-03-10 21:28:38 Pop. 0.5%
Jouan, P.-Y., Le Brizoual, L., Ganciu, M., Cardinaud, C., Tricot, S. & Djouadi, M.-A. (2010) HiPIMS Ion Energy Distribution Measurements in Reactive Mode. IEEE Trans. Plasma Sci. 38 3089–3094.   
Added by: Laurent Cournède 2016-03-10 21:37:31 Pop. 0.75%
Lallement, L., Rhallabi, A., Cardinaud, C. & Fernandez, M. C. P. (2011) Modelling of fluorine based high density plasma for the etching of silica glasses. J. Vac. Sci. Technol. A, 29 051304.   
Added by: Laurent Cournède 2016-03-10 21:32:20 Pop. 0.5%
Le Borgne, B., Girard, A., Cardinaud, C., Salaun, A.-C., Pichon, L. & Geneste, F. (2018) Covalent functionalization of polycrystalline silicon nanoribbons applied to Pb(II) electrical detection. Sensors and Actuators B-Chemical, 268 368–375.   
Last edited by: Richard Baschera 2018-07-24 13:00:00 Pop. 0.75%
Le Dain, G., Rhallabi, A., Girard, A., Cardinaud, C., Roqueta, F. & Boufnichel, M. (2019) Modeling of C4F8 inductively coupled plasmas: effects of high RF power on the plasma electrical properties. Plasma Sources Science & Technology, 28 085002.   
Last edited by: Richard Baschera 2019-08-23 13:36:25 Pop. 0.75%
Le Dain, G., Rhallabi, A., Cardinaud, C., Girard, A., Fernandez, M.-C., Boufnichel, M. & Roqueta, F. (2018) Modeling of silicon etching using Bosch process: Effects of oxygen addition on the plasma and surface properties. Journal of Vacuum Science & Technology A, 36 03E109.   
Last edited by: Richard Baschera 2018-07-24 12:58:27 Pop. 0.75%
Piet, J., Faider, W., Girard, A., Boulard, F. & Cardinaud, C. (2020) Investigation of organic precursors and plasma mixtures allowing control of carbon passivation when etching HgCdTe in hydrocarbon-based inductively coupled plasmas. Journal of Vacuum Science & Technology A, 38 053005.   
Last edited by: Richard Baschera 2020-11-17 13:38:54 Pop. 0.75%
Raballand, V., Cartry, G. & Cardinaud, C. (2007) Porous SiOCH, SiCH and SiO2 etching in high density fluorocarbon plasma with a pulsed bias. Plasma Process. Polym. 4 563–573.   
Added by: Laurent Cournède 2016-03-10 22:02:29 Pop. 0.5%
Sarrazin, A., Posseme, N., Pimenta-Barros, P., Barnola, S., Gharbi, A., Argoud, M., Tiron, R. & Cardinaud, C. (2018) Block copolymer selectivity: A new dry etch approach for cylindrical applications. Journal of Vacuum Science & Technology B, 36 041803.   
Last edited by: Richard Baschera 2018-08-20 09:24:00 Pop. 1%
Sarrazin, A., Posseme, N., Pimenta-Barros, P., Barnola, S., Tiron, R. & Cardinaud, C. (2019) New CH4-N-2 dry etch chemistry for poly(methyl methacrylate) removal without consuming polystyrene for lamellar copolymers application. J. Vac. Sci. Technol. B, 37 030601.   
Last edited by: Richard Baschera 2019-11-29 12:41:07 Pop. 0.75%
Sarrazin, A., Posseme, N., Pimenta-Barros, P., Barnola, S., Gharbi, A., Argoud, M., Tiron, R. & Cardinaud, C. (2016) PMMA removal selectivity to polystyrene using dry etch approach. J. Vac. Sci. Technol. B, 34 061802.   
Last edited by: Richard Baschera 2017-02-02 13:48:42 Pop. 0.5%
Sarrazin, A., Pimenta-Barros, P., Posseme, N., Barnola, S., Gharbi, A., Argoud, M., Tiron, R. & Cardinaud, C. (2015) PMMA removal selectivity to PS using dry etch approach for sub-10nm node applications.   
Last edited by: Richard Baschera 2018-03-07 11:37:08 Pop. 1%
Thiry, D., Chauvin, A., El Mel, A.-A., Cardinaud, C., Hamon, J., Gautron, E., Stephant, N., Granier, A. & Tessier, P.-Y. (2017) Tailoring the chemistry and the nano-architecture of organic thin films using cold plasma processes. Plasma Processes and Polymers, 14 e1700042.   
Last edited by: Richard Baschera 2017-12-05 15:48:56 Pop. 0.75%
Vermang, B., Brammertz, G., Meuris, M., Schnabel, T., Ahlswede, E., Choubrac, L., Harel, S., Cardinaud, C., Arzel, L., Barreau, N., van Deelen, J., Bolt, P.-J. & Bras, P. (2019) Wide band gap kesterite absorbers for thin film solar cells: potential and challenges for their deployment in tandem devices. Sustainable Energy & Fuels, 3 2246–2259.   
Last edited by: Richard Baschera 2019-09-18 08:16:49 Pop. 0.75%
Vlachopoulou, M.-E., Kokkoris, G., Cardinaud, C., Gogolides, E. & Tserepi, A. (2013) Plasma Etching of Poly(dimethylsiloxane): Roughness Formation, Mechanism, Control, and Application in the Fabrication of Microfluidic Structures. Plasma Process. Polym. 10 29–40.   
Added by: Laurent Cournède 2016-03-10 21:23:32 Pop. 0.5%
wikindx 4.2.2 ©2014 | Références totales : 2592 | Requêtes métadonnées : 121 | Exécution de script : 0.2357 secs | Style : Harvard | Bibliographie : Bibliographie WIKINDX globale