Belmahi, M., Bulou, S., Thouvenin, A., de Poucques, L., Hugon, R., Le Brizoual, L., Miska, P., Geneve, D., Vasseur, J.-L. & Bougdira, J. (2014) Microwave Plasma Process for SiCN:H Thin Films Synthesis with Composition Varying from SiC:H to SiN:H in H-2/N-2/Ar/Hexamethyldisilazane Gas Mixture. Plasma Process. Polym. 11 551–558. |
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Bulou, S., Le Brizoual, L., Hugon, R., De Poucques, L., Belmahi, M., Migeon, H.-N. & Bougdira, J. (2009) Characterization of a N-2/CH4 Microwave Plasma With a Solid Additive Si Source Used for SiCN Deposition. Plasma Process. Polym. 6 S576–S581. |
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Chanson, R., Rhallabi, A., Fernandez, M. C. & Cardinaud, C. (2013) Modeling of InP Etching Under ICP Cl2/Ar/N2 Plasma Mixture: Effect of N2 on the Etch Anisotropy Evolution. Plasma Process. Polym. 10 213–224. |
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Duquenne, C., Popescu, B., Tessier, P.-Y., Besland, M.-P., Scudeller, Y., Brylinski, C., Delage, S. & Djouadi, A. M. (2007) Magnetron Sputtering of Aluminium Nitride Thin Films for Thermal Management. Plasma Process. Polym. 4 S1–S5. |
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Granier, A., Begou, T., Makaoui, K., Soussou, A., Beche, B., Gaviot, E., Besland, M.-P. & Goullet, A. (2009) Influence of Ion Bombardment and Annealing on the Structural and Optical Properties of TiOx Thin Films Deposited in Inductively Coupled TTIP/O-2 Plasma. Plasma Process. Polym. 6 S741–S745. |
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Granier, A., Borvon, G., Bousquet, A., Goullet, A., Leteinturier, C. & van der Lee, A. (2006) Mechanisms involved in the conversion of ppHMDSO films into SiO2-like by oxygen plasma treatment. Plasma Process. Polym. 3 365–373. |
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Added by: Florent Boucher 2016-05-12 13:21:36 |
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Li, D., Elisabeth, S., Granier, A., Carette, M., Goullet, A. & Landesman, J.-P. (2016) Structural and Optical Properties of PECVD TiO2-SiO2 Mixed Oxide Films for Optical Applications. Plasma Process. Polym. 13 918–928. |
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Plujat, B., Glenat, H., Bousquet, A., Frezet, L., Hamon, J., Goullet, A., Tomasella, E., Hernandez, E., Quoizola, S. & Thomas, L. (2020) SiCN:H thin films deposited by MW-PECVD with liquid organosilicon precursor: Gas ratio influence versus properties of the deposits. Plasma Process. Polym. 17 e1900138. |
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Raballand, V., Cartry, G. & Cardinaud, C. (2007) Porous SiOCH, SiCH and SiO2 etching in high density fluorocarbon plasma with a pulsed bias. Plasma Process. Polym. 4 563–573. |
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Added by: Laurent Cournède 2016-03-10 22:02:29 |
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Saied, C., Chala, A., Nouveau, C., Djouadi, M. A. & Chekour, L. (2007) Determination of the Optimum Conditions for Ion Nitriding of 32CDV13 Low Alloy Steel. Plasma Process. Polym. 4 S757–S760. |
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Added by: Laurent Cournède 2016-03-10 22:02:30 |
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Supiot, P., Vivien, C., Granier, A., Bousquet, A., Mackova, A., Escaich, D., Clergereaux, R., Raynaud, P., Stryhal, Z. & Pavlik, J. (2006) Growth and modification of organosilicon films in PECVD and remote afterglow reactors. Plasma Process. Polym. 3 100–109. |
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Added by: Florent Boucher 2016-05-12 13:21:37 |
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Vlachopoulou, M.-E., Kokkoris, G., Cardinaud, C., Gogolides, E. & Tserepi, A. (2013) Plasma Etching of Poly(dimethylsiloxane): Roughness Formation, Mechanism, Control, and Application in the Fabrication of Microfluidic Structures. Plasma Process. Polym. 10 29–40. |
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Added by: Laurent Cournède 2016-03-10 21:23:32 |
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Zajickova, L., Bursikova, V., Franta, D., Bousquet, A., Granier, A., Goullet, A. & Bursik, J. (2007) Comparative Study of Films Deposited from HMDSO/O(2) in Continuous Wave and Pulsed rf Discharges. Plasma Process. Polym. 4 S287–S293. |
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Added by: Laurent Cournède 2016-03-10 22:02:30 |
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